Title:
エンボス付き離型紙およびその製造方法
Document Type and Number:
Japanese Patent JP5509567
Kind Code:
B2
Abstract:
This invention provides an embossed release paper that has high heat resistance and embossing properties. The embossed release paper comprises a paper base material, an ionizing radiation-cured resin layer, and a heat-cured silicone layer stacked in that order, the embossed release paper having embosses. The embossed release paper has high heat resistance and thus is suitable for use in synthetic leather production and melamine decorative sheet production that involve surface emboss pattern formation.
Inventors:
Kyoko Kogo
Tokuyuki Shiina
Tokuyuki Shiina
Application Number:
JP2008258374A
Publication Date:
June 04, 2014
Filing Date:
October 03, 2008
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
B32B27/00; D21H27/00; D21H27/30
Domestic Patent References:
| JP7276569A | ||||
| JP2007023420A |
Foreign References:
| WO2007091593A1 |
Attorney, Agent or Firm:
Satoshi Watanabe