Title:
回路基板
Document Type and Number:
Japanese Patent JP5516787
Kind Code:
B2
Abstract:
To provide a circuit board capable of preventing an electronic component from being detached from the circuit board. A laminated body (11) is composed of a laminate of a plurality of insulating-material layers (16) made of a flexible material. External electrodes (12) are provided on the top surface of the laminated body (11). An electronic component is mounted on the external electrodes (12). A plurality of internal conductors(20), when viewed in plan in the z-axis direction, are overlaid on the external electrodes (12) and are not connected to one another in regions where the internal conductors (20) are overlaid on the external electrodes (12).
Inventors:
Tokiko Kato
Application Number:
JP2013071431A
Publication Date:
June 11, 2014
Filing Date:
March 29, 2013
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H05K3/46
Domestic Patent References:
| JP2006093438A | ||||
| JP2003332749A | ||||
| JP2004311628A | ||||
| JP2001332860A | ||||
| JP2008193132A |
Foreign References:
| US20080289853 | ||||
| US5949654 |
Attorney, Agent or Firm:
Patent business corporation Profic patent office
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