Title:
半導体モジュール
Document Type and Number:
Japanese Patent JP5525856
Kind Code:
B2
Inventors:
Masanori Usui
Yukio Miyaji
Yuji Nagata
Fukami Takeshi
Yukio Miyaji
Yuji Nagata
Fukami Takeshi
Application Number:
JP2010038070A
Publication Date:
June 18, 2014
Filing Date:
February 24, 2010
Export Citation:
Assignee:
Toyota Central R & D Labs.
TOYOTA JIDOSHA KABUSHIKI KAISHA
TOYOTA JIDOSHA KABUSHIKI KAISHA
International Classes:
H01L21/52
Domestic Patent References:
| JP2010056354A | ||||
| JP1059986A | ||||
| JP8008372A | ||||
| JP10050734A | ||||
| JP2008294284A | ||||
| JP2011114157A |
Attorney, Agent or Firm:
Kenji Yoshida
Jun Ishida
Jun Ishida