Title:
電子部品実装ライン及び電子部品実装方法
Document Type and Number:
Japanese Patent JP5526285
Kind Code:
B2
Abstract:
Disclosed is an electronic component mounting line on which a substrate undergoes solder paste printing, electronic component placements, and then reflow, while being moved from upstream to downstream. The line includes: a substrate feeding machine; a screen printing machine for applying solder paste to the substrate; a resin dispensing machine arranged downstream of the screen printing machine, for dispensing a thermosetting resin onto at least one reinforcement position on the substrate; a second electronic component placement machine arranged adjacent to and downstream of the resin dispensing machine, for placing a second electronic component on the substrate, such that its peripheral edge portion comes in contact with the resin; a first electronic component placement machine arranged downstream of the second electronic component placement machine, for placing a first electronic component on the substrate; and a reflow machine for bonding the electronic components to the substrate, by heating and cooling the resultant.
Inventors:
Ken Maeda
Hiroki Enao
Tsubasa Saeki
Hiroki Enao
Tsubasa Saeki
Application Number:
JP2013510437A
Publication Date:
June 18, 2014
Filing Date:
October 19, 2012
Export Citation:
Assignee:
Panasonic Corporation
International Classes:
H05K13/04
Domestic Patent References:
| JP2007018505A | 2007-01-25 | |||
| JP2010251579A | 2010-11-04 | |||
| JP2005026648A | 2005-01-27 | |||
| JP2007018505A | 2007-01-25 | |||
| JP2010251579A | 2010-11-04 | |||
| JP2005026648A | 2005-01-27 |
Attorney, Agent or Firm:
Shinichi Kawasaki
Takaomi Tsujimoto
Kazuo Ishii
Takaomi Tsujimoto
Kazuo Ishii