Title:
樹脂組成物及びそれを含む被膜形成材料
Document Type and Number:
Japanese Patent JP5526778
Kind Code:
B2
Abstract:
Disclosed is a resin composition comprising: a component (A) which is a resin having an acid anhydride group and/or a carboxyl group; a component (B) which is an epoxy resin; and a component (C) which is a filler comprising hydrotalcite. The component (A) preferably has a polycarbonate skeleton, more preferably has a constituent unit represented by the general formula (1). (1) wherein multiple R's independently represent an alkylene group having 1 to 18 carbon atoms; multiple X's independently represent an alkylene having 1 to 18 carbon atoms or an arylene group; and m and n independently represent an integer of 1 to 20. The resin composition can be used suitably in screen printing, has reduced adhesion to a polyimide film which is a cured coating film, and enables to reduce the occurrence of black blister in an electrode upon applying current under high-temperature and high-humidity conditions. Also disclosed is a film-forming material comprising the resin composition.
Inventors:
Uehara Satoshi
Tomohiro Hirata
Susumu Kaneko
Sukiyori Somaru
Matsuzaka Osamu
Tomohiro Hirata
Susumu Kaneko
Sukiyori Somaru
Matsuzaka Osamu
Application Number:
JP2009515186A
Publication Date:
June 18, 2014
Filing Date:
May 15, 2008
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C08L79/08; C08G73/10; C08K3/26; C08K3/30; C08L63/00; C09D7/61
Domestic Patent References:
| JP2003213083A | 2003-07-30 | |||
| JP2005036126A | 2005-02-10 | |||
| JP2000150588A | 2000-05-30 | |||
| JP2004137370A | 2004-05-13 | |||
| JP2003138015A | 2003-05-14 | |||
| JP2003198105A | 2003-07-11 |
Attorney, Agent or Firm:
Hiroaki Sakai