スパッタ装置 - ULVAC, Inc.

Title:

スパッタ装置

Document Type and Number:

Japanese Patent JP5527894

Kind Code:

B2

More Like This:

WO/2022/145244	SPUTTERING TARGET MEMBER, MANUFACTURING METHOD THEREOF, SPUTTERING FILM MANUFACTURING METHOD, AND MAGNETRON SPUTTERING DEVICE
JPS6028689	[Title of the device] Sputtering system

Inventors:

Harunori Iwai
Kubo Shoji
Takayuki Ozawa

Application Number:

JP2010196170A

Publication Date:

June 25, 2014

Filing Date:

September 01, 2010

Export Citation:

Assignee:

ULVAC, Inc.

International Classes:

C23C14/35; C23C14/34

Domestic Patent References:

Foreign References:

WO2007046244A1

Attorney, Agent or Firm:

Hiroyuki Kurihara
Muranaka

Previous Patent: APPARATUS FOR FIXING QUARTZ TUBE IN MINERAL ACID CONN CENTRATING DEVICE

Next Patent: GASSPERMEABLE HEATTRESISTING MEMBER