Title:
エポキシ樹脂、硬化性樹脂組成物、その硬化物、及びプリント配線基板
Document Type and Number:
Japanese Patent JP5532368
Kind Code:
B1
Abstract:
The preset invention provides a curable resin composition which causes little change in heat resistance after a heat history of cured products and exhibits low thermal expandability, and also provides a cured product of the curable resin composition, a printed circuit board causing little change in heat resistance after a heat history and having excellent low thermal expandability, and an epoxy resin having these performances. The epoxy resin is produced by polyglycidyl-etherification of a reaction product of para-cresol, a β-naphthol compound, and formaldehyde, the epoxy resin containing a trifunctional compound (x) represented by a structural formula (1) below and a dimer (y) represented by a structural formula (2) below, and the content of the trifunctional compound (x) is 55% or more in terms of ratio by area in GPC measurement.
Inventors:
Yasushi Sato
Application Number:
JP2014504099A
Publication Date:
June 25, 2014
Filing Date:
August 29, 2013
Export Citation:
Assignee:
DIC Corporation
International Classes:
C08G59/04; H05K1/03
Domestic Patent References:
| JPH05218239A | 1993-08-27 | |||
| JPH05206330A | 1993-08-13 | |||
| JPH05226102A | 1993-09-03 | |||
| JP2000273144A | 2000-10-03 | |||
| JPH05247180A | 1993-09-24 | |||
| JP2000053739A | 2000-02-22 | |||
| JPH05218239A | 1993-08-27 | |||
| JPH05206330A | 1993-08-13 | |||
| JPH05226102A | 1993-09-03 | |||
| JP2000273144A | 2000-10-03 | |||
| JPH05247180A | 1993-09-24 |
Attorney, Agent or Firm:
Kono Tsuyo