To provide a liquid epoxy resin composition for semiconductor encapsulation that serves as an underfill material for COC upon encapsulation of a semiconductor device, and has both of penetrativity into gaps among a substrate and a component, etc., and preventive function of contamination to the component (prevention of bleeding), as well as to provide a flip chip semiconductor device using a cured product of the resin composition as the underfill material.
This liquid epoxy resin composition includes (A) a liquid epoxy resin, (B) a curing agent, and (C) a spherical silica powder of a mean particle diameter of 0.1-1.0 μm as essential components, wherein the composition contains 20-60 mass% of the spherical silica powder. The liquid epoxy resin composition meets following conditions: (1) viscosity at room temperature is ≤20 Pa s; (2) a period of time for viscosity behavior to reach 10 times, when held at 120°C, is 30-100 s; (3) penetration time up to 10 mm depth in a gap of double glass plates having a gap of 10 μm heated to 120°C is ≤60 s; and (4) when 3 mg is dropped on a Si mirror plane in an environment of 120°C and a spread of the droplet ends, a diameter of the droplet is ≤5 mm. There are also disclosed the liquid epoxy resin composition for semiconductor encapsulation having both of the penetrativity into gaps and the contamination preventive function, as well as the flip chip semiconductor device using the composition.
COPYRIGHT: (C)2010,JPO&INPIT
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Saori Shigematsu
Katsunari Kobayashi
Takeshi Ishikawa
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