Title:
プリント配線板の製造方法、プリント配線板及び電子機器
Document Type and Number:
Japanese Patent JP5533596
Kind Code:
B2
Abstract:
A method for manufacturing a printed wiring board includes filling material in through holes formed in first lands on a first substrate, forming projection portions projecting from the first lands on the surface of the material of the through holes, placing a conductive material on the first lands, and electrically connecting the first lands of the first substrate and second lands of second substrate by pressing the conductive material under melting filled between the first and second lands in the lamination direction of the substrates by the projection portions when laminating the substrates in such a manner that the lands of the other substrate face the lands of the substrate for aggregation of the conductive material.
Inventors:
Hideaki Yoshimura
Naoto Motooka
Yasuhiro Karahashi
Asami Motofuji
Satoshi Yamagishi
Hiromitsu Kobayashi
Naoto Motooka
Yasuhiro Karahashi
Asami Motofuji
Satoshi Yamagishi
Hiromitsu Kobayashi
Application Number:
JP2010262890A
Publication Date:
June 25, 2014
Filing Date:
November 25, 2010
Export Citation:
Assignee:
富士通株式会社
International Classes:
H05K3/46
Domestic Patent References:
| JP3107888A | ||||
| JP2005217056A | ||||
| JP2003133674A |
Attorney, Agent or Firm:
Hiroaki Sakai