Title:
均熱処理装置
Document Type and Number:
Japanese Patent JP5536224
Kind Code:
B2
Abstract:
An isothermal heating apparatus includes a plate including formed therein a heat pipe circuit in which working fluid is charged, and a heating mechanism heating the working fluid. The heat pipe circuit includes a header portion at which the working fluid is heated and evaporated and a plurality of branch portions in which vapor produced by vaporization of the working fluid exchanges heat with the plate and condensates, the branch portions branching off from the header portion. The heating mechanism is provided on an evaporating surface side of the header portion with which the working fluid is in contact when the heating mechanism heats the working fluid. The isothermal heating apparatus can achieve isothermal heating of a heat-treatment subject and size reduction of the apparatus.
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Inventors:
Junichi Uno
Hisaaki Yamakage
Takeshi Funabiki
Yoshito Yamada
Hisaaki Yamakage
Takeshi Funabiki
Yoshito Yamada
Application Number:
JP2012536109A
Publication Date:
July 02, 2014
Filing Date:
October 01, 2010
Export Citation:
Assignee:
Toshiba Mitsubishi Electric Industrial Systems Co., Ltd.
International Classes:
H01L21/027; F28D15/02; H01L21/324
Domestic Patent References:
| JPS56127191A | 1981-10-05 | |||
| JP2009302417A | 2009-12-24 | |||
| JP2007294688A | 2007-11-08 | |||
| JP2009105156A | 2009-05-14 | |||
| JP2011122813A | 2011-06-23 | |||
| JPH04363588A | 1992-12-16 | |||
| JPH09293730A | 1997-11-11 | |||
| JP2005195296A | 2005-07-21 | |||
| JP2003139476A | 2003-05-14 | |||
| JP2001349682A | 2001-12-21 | |||
| JPS56127191A | 1981-10-05 | |||
| JP2009302417A | 2009-12-24 | |||
| JP2007294688A | 2007-11-08 | |||
| JP2009105156A | 2009-05-14 |
Attorney, Agent or Firm:
Fukami patent office