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Title:
硬化性組成物
Document Type and Number:
Japanese Patent JP5550351
Kind Code:
B2
Abstract:
The present invention provides a curable composition comprising: (a) a resin composition being liquid at 23° C. and comprising monomers or oligomers or a mixture of monomers and oligomers polymerizable by a ring-opening reaction; (b) an impact modifier containing one or more block copolymers having at least one block composed of methyl methacrylate and (c) one or more polymerization initiators. The curable resin composition can be used for curable coatings per se and in specific for stereolithography and other applications such as three dimensional printing applications where a 3D object is formed.

Inventors:
Metz, Roy
シャペラ, カロール
Application Number:
JP2009553129A
Publication Date:
July 16, 2014
Filing Date:
March 12, 2008
Export Citation:
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Assignee:
Three D Systems インコーポレーテッド
International Classes:
C08L63/00; B29C67/00; C08G59/68; C08J3/20
Attorney, Agent or Firm:
Ono Shinjiro
Kobayashi 泰
Hiroyuki Tomita
Hoshino 修
Mitsutoshi Nakamura



 
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