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Title:
熱硬化性エポキシ樹脂組成物、光半導体装置用反射部材及び光半導体装置
Document Type and Number:
Japanese Patent JP5557770
Kind Code:
B2
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Inventors:
Yusuke Taguchi
Kazutoshi Tomiyoshi
Application Number:
JP2011030861A
Publication Date:
July 23, 2014
Filing Date:
February 16, 2011
Export Citation:
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Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08L63/06; C08G59/32; C08K3/22; C08K3/24; C08K5/10; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Eiichiro Shimazaki



 
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