Title:
冷却装置およびそれを備えた電力変換装置
Document Type and Number:
Japanese Patent JP5560182
Kind Code:
B2
Abstract:
It is an object of this invention to reduce the size and weight of a heat pipe cooling device for an electric conversion device by making the temperature of a heat receiving member with attached power semiconductor devices uniform. In a cooling device which transmits heat generated from power devices attached to the surface of a heat block to fins by heat pipes and provides cooling by natural convection or forced convection of air flowing among the fins, parts extending upward toward the fins of ones on the downstream side of the heat pipes are arranged more densely than upwardly extending parts of ones on the upstream side of the heat pipes.
Inventors:
Funakoshi 砂穂
Yosuke Yasuda
Ken Tanaka
Akihiro Hishida
Yosuke Yasuda
Ken Tanaka
Akihiro Hishida
Application Number:
JP2010289095A
Publication Date:
July 23, 2014
Filing Date:
December 27, 2010
Export Citation:
Assignee:
Hitachi, Ltd.
International Classes:
H01L23/427; F28D15/02; H05K7/20
Attorney, Agent or Firm:
Manabu Inoue
Yuji Toda
Shigemi Iwasaki
Yuji Toda
Shigemi Iwasaki