Title:
半導体基板洗浄液組成物
Document Type and Number:
Japanese Patent JP5561914
Kind Code:
B2
Abstract:
It is an object of the present invention to provide a liquid composition for cleaning a semiconductor substrate capable of removing metal impurities on the substrate surface without corroding a copper wiring in the manufacturing process of a semiconductor circuit element. According to the present invention, by means of a cleaning liquid composition for cleaning a semiconductor substrate, comprising one or more aliphatic polycarboxylic acids and one or more basic amino acids, metal impurities can be removed without corroding the copper wiring in a cleaning process of a semiconductor substrate having a copper wiring, in particular in a cleaning process of a semiconductor substrate in which the copper wiring is exposed after chemical mechanical polishing (CMP).
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Inventors:
Yutaka Murakami
Norio Ishikawa
Norio Ishikawa
Application Number:
JP2008130153A
Publication Date:
July 30, 2014
Filing Date:
May 16, 2008
Export Citation:
Assignee:
Kanto Chemical Co., Ltd.
International Classes:
H01L21/304; B08B3/08
Domestic Patent References:
| JP2004531637A | ||||
| JP2007526647A | ||||
| JP8100279A | ||||
| JP20084621A | ||||
| JP2005217114A | ||||
| JP2005512790A |
Foreign References:
| WO2007119392A1 |
Attorney, Agent or Firm:
Kiyoji Kuzuwa