Title:
半導体装置
Document Type and Number:
Japanese Patent JP5563760
Kind Code:
B2
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Inventors:
Kenki Nagata
Application Number:
JP2008323908A
Publication Date:
July 30, 2014
Filing Date:
December 19, 2008
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
H01L29/78; H01L21/336
Domestic Patent References:
| JP9023001A | ||||
| JP2006135038A | ||||
| JP2002314080A |
Attorney, Agent or Firm:
Inaoka cultivation
Mio Kawasaki
Mio Kawasaki