Title:
半導体製造工程用テープの基材フィルム
Document Type and Number:
Japanese Patent JP5568428
Kind Code:
B2
Inventors:
Hidekazu Kobayashi
Application Number:
JP2010221118A
Publication Date:
August 06, 2014
Filing Date:
September 30, 2010
Export Citation:
Assignee:
Achilles Corporation
International Classes:
H01L21/301; C09J7/02
Domestic Patent References:
| JP2011083960A | ||||
| JP2009231700A | ||||
| JP2000124169A |
Attorney, Agent or Firm:
Calyx
Miyazaki Yoshio
Tsutomu Kato
Kyoko Oyama
Companion wisdom
Miyazaki Yoshio
Tsutomu Kato
Kyoko Oyama
Companion wisdom
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