Title:
ウェーハ表面測定装置
Document Type and Number:
Japanese Patent JP5581713
Kind Code:
B2
Abstract:
A wafer surface measuring apparatus which measures a surface of the wafer by irradiating a laser beam on a wafer comprising a measuring stage that supports the outer edge of the wafer and loads the wafer in a manner not contacting the rear surface of the wafer and the stage surface, a wafer carrying means that moves the wafer over the measuring stage and loads the wafer on the measuring stage from an upward side, a rotary drive unit which rotates the measuring stage, and an ejection hole formed at a center portion of the stage surface to supply gas to a rear surface of the wafer loaded on the measuring stage. The wafer carrying means includes a chuck which sucks and holds the surface of the wafer in a non-contact manner and bends the wafer in an upwardly convex shape.
Inventors:
Eiji Kamiyama
Etsuro Morita
Etsuro Morita
Application Number:
JP2010021360A
Publication Date:
September 03, 2014
Filing Date:
February 02, 2010
Export Citation:
Assignee:
Incorporated company SUMCO
International Classes:
H01L21/677; B65G49/07; H01L21/66
Attorney, Agent or Firm:
Masatake Shiga
Norio Takahashi
Yasuhiko Murayama
Norio Takahashi
Yasuhiko Murayama