Title:
半導体装置及び半導体装置の製造方法
Document Type and Number:
Japanese Patent JP5585518
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device and a semiconductor device manufacturing method, which can improve a freedom degree of a connection position of an external connection terminal to a heat dissipation member and electrical connection reliability between the external connection terminal and the heat dissipation member.SOLUTION: A collector terminal 50 and an emitter terminal 60 include connection parts 51, 61 connected to one surfaces of heat dissipation members 30, 20 by conductive connection members 92, 95, respectively, and extension parts 53, 63 continuously extending from the connection parts 51, 61 to the outside of a mold resin 80, respectively. The extension parts 53, 63 include facing parts 52, 62 curved from the connection parts 51, 61 to face one lateral faces 33, 23 of the heat dissipation members 30, 20, respectively.
Inventors:
Keita Fukutani
Application Number:
JP2011086690A
Publication Date:
September 10, 2014
Filing Date:
April 08, 2011
Export Citation:
Assignee:
Denso, Inc.
International Classes:
H01L23/29
Attorney, Agent or Firm:
Kazuyuki Yahagi
Yasuhei Nonobe
Takanori Kubo
Yasuhei Nonobe
Takanori Kubo