Title:
配線基板及び実装構造体
Document Type and Number:
Japanese Patent JP5587116
Kind Code:
B2
Inventors:
Hidetoshi Yukawa
Application Number:
JP2010212533A
Publication Date:
September 10, 2014
Filing Date:
September 22, 2010
Export Citation:
Assignee:
KYOCERA CORP.
International Classes:
H05K3/38; H05K1/09
Attorney, Agent or Firm:
Takahisa Sato