半導体モジュール、および半導体モジュールの製造方法 - Hitachi auto モティブ systems incorporated company

Title:

半導体モジュール、および半導体モジュールの製造方法

Document Type and Number:

Japanese Patent JP5591396

Kind Code:

B2

Abstract:

A semiconductor module (300a) includes a case including a receiving space which is formed by a frame portion (304A3) and a pair of wall portions (304A1, 304A2) disposed to face each other with the frame portion (304A3) therebetween. The wall portion (304A1) includes a heat dissipation portions (307A, 307B) and a support wall (3041) which supports the heat dissipation portions (307A, 307B) at the frame portion (304A3), and the wall portion (304A2) includes a heat dissipation portion (307C) and a support wall (3043) which supports the heat dissipation portion (307C) at the frame portion (304A3). The heat dissipation portions (307A, 307B) provided at the wall portion (304A1) are separately provided by being disposed to face a plurality of semiconductor device blocks respectively. A plurality of separate heat dissipation portions (307A, 307B) is surrounded by the support wall (3041), the support wall (3041) is deformed to recessed from the frame portion (304A3) through the separate heat dissipation portions (307A, 307B) inside the case such that a plurality of insulating sheets (333) is closely joined to a plurality of lead frames (318, 319) and the plurality of heat dissipation portions (307A, 307B) respectively.

Inventors:

Eiichi Ide
Tokuyama 健
露野円丈
Kin-ya Nakatsu
Suwa Tokihito
Kaneko 裕二朗

Application Number:

JP2013503247A

Publication Date:

September 17, 2014

Filing Date:

March 04, 2011

Export Citation:

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