Title:
電子部品モジュールの製造方法
Document Type and Number:
Japanese Patent JP5594324
Kind Code:
B2
Abstract:
In a bond portion between an electrical conductive land and a connection terminal member, an intermetallic compound producing region in which at least a Cu—Sn-based, an M-Sn-based (M indicates Ni and/or Mn), and a Cu-M-Sn-based intermetallic compound are produced is arranged so as to be present at a connection terminal member side. In this intermetallic compound producing region, when a cross section of the bond portion is equally defined into 10 boxes in a longitudinal direction and a lateral direction to define 100 boxes in total, a ratio of the number of boxes in each of which at least two types of intermetallic compounds having different constituent elements are present to the total number of boxes other than boxes in each of which only a Sn-based metal component is present is about 70% or more.
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Inventors:
Chuetsu Hero
Arboreal vegetation Yoichi
Nobuaki Ogawa
Hidekiyo Takaoka
Kosuke Nakano
Arboreal vegetation Yoichi
Nobuaki Ogawa
Hidekiyo Takaoka
Kosuke Nakano
Application Number:
JP2012140819A
Publication Date:
September 24, 2014
Filing Date:
June 22, 2012
Export Citation:
Assignee:
Murata Manufacturing Co., Ltd.
International Classes:
H05K3/34; B23K1/00; B23K1/20; B23K35/26; B23K35/363; C22C9/05; C22C9/06; C22C13/00; C22C13/02; H01L23/12; H01L25/04; H01L25/18; B23K101/42
Attorney, Agent or Firm:
Masaaki Koshiba