Title:
ブロック共重合体を用いてホール又はビアを有するデバイスを形成する方法
Document Type and Number:
Japanese Patent JP5596133
Kind Code:
B2
Abstract:
An opening in a substrate is formed, e.g., using optical lithography, with the opening having sidewalls whose cross section is given by segments that are contoured and convex. The cross section of the opening may be given by overlapping circular regions, for example. The sidewalls adjoin at various points, where they define protrusions. A layer of polymer including a block copolymer is applied over the opening and the substrate, and allowed to self-assemble. Discrete, segregated domains form in the opening, which are removed to form holes, which can be transferred into the underlying substrate. The positions of these domains and their corresponding holes are directed to predetermined positions by the sidewalls and their associated protrusions. The distances separating these holes may be greater or less than what they would be if the block copolymer (and any additives) were to self-assemble in the absence of any sidewalls.
Inventors:
A chain, a joy
ナ, ヨンヘ
A lei, car phi
レトナー, Charles, Thomas
Sanders, Daniel, a pole
Lee, ワイキン
ナ, ヨンヘ
A lei, car phi
レトナー, Charles, Thomas
Sanders, Daniel, a pole
Lee, ワイキン
Application Number:
JP2012511217A
Publication Date:
September 24, 2014
Filing Date:
April 23, 2010
Export Citation:
Assignee:
International Business Machines corporation INTERNATIONAL BUSINESS MACHINES CORPORATION
International Classes:
H01L21/768; B82Y40/00; H01L21/027; H01L21/312; H01L23/522
Attorney, Agent or Firm:
Tsuyoshi Ueno
Tasa Kind 1
About a city Yoshihiro
Tasa Kind 1
About a city Yoshihiro