Title:
モジュール基板およびその製造方法
Document Type and Number:
Japanese Patent JP5601497
Kind Code:
B2
Inventors:
Mitsuyasu Ishihara
Application Number:
JP2010067805A
Publication Date:
October 08, 2014
Filing Date:
March 24, 2010
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
H05K3/34; H01L23/12; H05K1/02