Title:
多層プリント配線板の製造方法
Document Type and Number:
Japanese Patent JP5604585
Kind Code:
B2
Abstract:
A manufacturing method of a multilayer printed wiring board in which a copper foil with carrier foil consists of at least four layers, a carrier foil/a release layer/a heat-resistant metal layer/a copper foil layer is used; a supporting substrate is manufactured by laminating an insulating layer constituting material on the surface of the copper foil layer constituting the copper foil with carrier foil; a supporting substrate with build-up wiring layer is manufactured by forming a build-up wiring layer on the surface of the carrier foil constituting the copper foil with carrier foil in the supporting substrate; the resulted supporting substrate with build-up wiring layer is separated at the release layer to manufacture a multilayered laminate; the resulted multilayered laminate is processed a necessary procedures to manufacture a multilayer printed wiring board.
Inventors:
Ayumi Tatsuoka
Shin-ichi Obata
Toshiyuki Shimizu
Shin-ichi Obata
Toshiyuki Shimizu
Application Number:
JP2013507718A
Publication Date:
October 08, 2014
Filing Date:
March 29, 2012
Export Citation:
Assignee:
Mitsui Mining and Smelting Co., Ltd.
International Classes:
H05K3/46
Domestic Patent References:
| JP2010092907A | 2010-04-22 | |||
| JP2008218450A | 2008-09-18 | |||
| JP2010222657A | 2010-10-07 | |||
| JP2010092907A | 2010-04-22 |
Attorney, Agent or Firm:
Katsuhiro Yoshimura