Title:
固体撮像装置
Document Type and Number:
Japanese Patent JP5606182
Kind Code:
B2
Abstract:
The present invention provides a solid-state imaging device including a first substrate provided with a plurality of photoelectric conversion units thereon, and a second substrate provided with a reading circuit and parallel processing circuits thereon. The solid-state imaging device includes a DC voltage supply wiring configured to supply a DC voltage to the plurality of parallel processing circuits. The DC voltage supply wiring is formed by electrically connecting first conductive patterns provided on the first substrate with second conductive patterns provided on the second substrate.
Inventors:
Shimozu 佐 Mineo
Application Number:
JP2010149477A
Publication Date:
October 15, 2014
Filing Date:
June 30, 2010
Export Citation:
Assignee:
Canon, Inc.
International Classes:
H01L27/146; H01L21/768; H01L21/822; H01L27/04; H04N5/357
Attorney, Agent or Firm:
Takuma Abe
Kuroiwa 創吾
Kuroiwa 創吾