Title:
低反発性電解銅箔、該電解銅箔を使用した配線板及びフレキシブル配線板
Document Type and Number:
Japanese Patent JP5607862
Kind Code:
B1
Abstract:
Provided is an electrolytic copper foil for flexible circuit boards, the foil being easy to handle in production/processing lines, having excellent low spring-back after the heat treatment applied in the film application process, being able to cope with reductions in the size of electrical machinery, and for which excessive coarsening of crystal grain structure is limited and fine patterning properties are excellent. An electrolytic copper foil with excellent low spring-back for which a numerical value y1, which represents rigidity and is based on a stress X1 (MPa) of a 0.2% distortion measured at normal temperature after a 300°C × 1 hour heat treatment, is less than 800 and a numerical value y2, which represents the extent of change in rigidity associated with bending and is based on the stress X1 (MPa) and a stress X2 (MPa) of a 0.4% distortion, is 1.5 or more. For the electrolytic copper foil with excellent low spring-back, it is preferable that a numerical value y3, which represents rigidity and is based on a pre-heat treatment stress X3 (MPa) of a 0.2% distortion, is 600 or more and less than 1000. y1 = (X1/0.2) y2 = (X1/0.2)/(X2/0.4) y3 = (X3/0.2)
Inventors:
Takahiro Saito
Application Number:
JP2014519329A
Publication Date:
October 15, 2014
Filing Date:
December 26, 2013
Export Citation:
Assignee:
The Furukawa Electric Co., Ltd.
International Classes:
C25D1/04; H05K1/09
Domestic Patent References:
| JPH09143785A | 1997-06-03 | |||
| JP2004339558A | 2004-12-02 | |||
| JP2008013847A | 2008-01-24 | |||
| JP5391366B2 | 2014-01-15 |
Attorney, Agent or Firm:
Takahisa Sato