Title:
熱圧着ヘッド、実装装置及び実装方法
Document Type and Number:
Japanese Patent JP5608545
Kind Code:
B2
Abstract:
The present invention relaxes thermal shock on constituent components in the proximity of a mounted part. In a thermocompression head (3) that connects mounting components (18, 21) to mounting parts (20, 22) by heating and application of pressure to the mounting components (18, 21) via a thermosetting adhesive layer (23), the thermocompression head (3) has a Peltier element (5). When the Peltier element (5) heats and applies pressure to the mounting parts (18, 21) the surface side in mutual opposition to another constituent component (15) provided in proximity to the mounting parts (20, 22) is set as a cooling part (6).
Inventors:
Yoshito Tanaka
Application Number:
JP2010288320A
Publication Date:
October 15, 2014
Filing Date:
December 24, 2010
Export Citation:
Assignee:
デクセリアルズ, Inc.
International Classes:
H01L21/60; H05K3/32
Attorney, Agent or Firm:
Akira Koike
Seiji Iga
Fujii Toshiya
Nobuhiro Noguchi
Sukenari Atsuya
Seiji Iga
Fujii Toshiya
Nobuhiro Noguchi
Sukenari Atsuya