Title:
新規なポリイミドフィルム並びにそれを用いて得られる接着フィルム、フレキシブル金属張積層板
Document Type and Number:
Japanese Patent JP5613300
Kind Code:
B2
Abstract:
A polyimide film which, especially when superposed on a metal layer by the laminating method, has the function of diminishing the thermal distortion to be imposed on the material; an adhesive film and a flexible metal-clad laminate each comprising or obtained with the polyimide film. the polyimide film is obtained by reacting an aromatic diamine with an aromatic acid dianhydride and imidiating the polyamic acid obtained, and has a storage elastic modulus in a specific range.
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Inventors:
菊池 剛
金城 永泰
金城 永泰
Application Number:
JP2013150488A
Publication Date:
October 22, 2014
Filing Date:
July 19, 2013
Export Citation:
Assignee:
株式会社カネカ
International Classes:
C08J5/18; B29C41/28; C08G73/10; C09J7/25; C09J7/35; C09J179/08; H05K1/03
Attorney, Agent or Firm:
Patent business corporation HARAKENZO WORLD PATENT & TRADEMARK