To provide a current lead easily manufactured and miniaturized while reducing the amount of heat intrusion.

A composite substrate formed with an intermediate layer on an oriented Ni-W substrate having a predetermined area is coated thereon with a YBCO oxide superconductive layer and a stabilizing layer by a TFA-MOD method to prepare an oxide superconductor, and the oxide superconductor is punched to form current paths of meander shape. A plurality of current paths of meander shape are placed on the surface of a support member to which a pair of electrodes A, B are connected through low heat conductive members made of an electric insulating material, and after both ends 1a, 1b are connected to the electrodes A, B respectively, fixing by an insulating plate and an insulating sheet and storage into a metal case are performed to prepare the current lead.

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