Title:
銅または銅合金の表面処理剤及びその利用
Document Type and Number:
Japanese Patent JP5615227
Kind Code:
B2
Abstract:
A surface treating composition for copper or a copper alloy comprising an imidazole compound and means for using the composition in the soldering of electronic parts to printed wiring boards are disclosed.
Inventors:
平尾 浩彦
山地 範明
中西 正人
村井 孝行
山地 範明
中西 正人
村井 孝行
Application Number:
JP2011114289A
Publication Date:
October 29, 2014
Filing Date:
May 23, 2011
Export Citation:
Assignee:
四国化成工業株式会社
International Classes:
C23C22/52; H05K3/28