Title:
電子モジュールの製造方法及び電子モジュール並びに車両
Document Type and Number:
Japanese Patent JP5621217
Kind Code:
B2
Abstract:
Disclosed is a method of producing an electronic module, wherein vibration resistance with respect to vibration, strength with respect to impact, and waterproofness are all secured, production costs are reduced, and production steps are made simpler. The method produces an electronic module (1) including an electronic part (2) and a mounting part (3) for mounting the module to an outside part and includes a step of using a die (Di), which includes a cavity (Co) which holds sealing resin (4) and is open to the outside, and disposing the electronic part (2) in the cavity (Co) of the die (Di) before or after the sealing resin (4) flows in, a step of disposing the mounting part (3) in a way that secures the positional relationship with respect to the die (Di) so that a portion of the mounting part (3) (U-shaped part 3b) is positioned in the cavity (Co) and the other portion (the flange part 3a) projects from the cavity (Co) to the open side, a step of making the sealing resin (4) flow into the cavity (Co) of the die (Di), a step of curing the sealing resin (4) in a state in which the electronic part (2) and a portion of the mounting part (3) (the U-shaped part) are immersed in the sealing resin (4) which has flowed into the cavity (Co) of the die (Di), and a step of extracting the cured sealing resin (4) from the die (Di). The electronic module (1) is thereby produced.
Inventors:
片田 英肇
川瀬 昌二
川瀬 昌二
Application Number:
JP2009139842A
Publication Date:
November 12, 2014
Filing Date:
June 11, 2009
Export Citation:
Assignee:
シンフォニアテクノロジー株式会社
International Classes:
H01L21/56; H01R12/72
Attorney, Agent or Firm:
Onishi Masanao
Tetsuya Tsubouchi
Tetsuya Tsubouchi