Title:
回路基板の製造方法
Document Type and Number:
Japanese Patent JP5621311
Kind Code:
B2
Inventors:
水谷 大輔
Application Number:
JP2010108979A
Publication Date:
November 12, 2014
Filing Date:
May 11, 2010
Export Citation:
Assignee:
富士通株式会社
International Classes:
H05K1/11; H05K3/24; H05K3/40; H05K3/46
Attorney, Agent or Firm:
Tadahiko Ito
Yamaguchi Akinori
Yamaguchi Akinori