Title:
半導体用接着剤および半導体装置
Document Type and Number:
Japanese Patent JP5625430
Kind Code:
B2
More Like This:
| JPH05335354 | SEMICONDUCTOR DEVICE WITH ADHESIVE |
Inventors:
金森 直哉
大久保 光
大久保 光
Application Number:
JP2010070928A
Publication Date:
November 19, 2014
Filing Date:
March 25, 2010
Export Citation:
Assignee:
住友ベークライト株式会社
International Classes:
H01L21/52; C08G59/02; C09J11/00; C09J163/00