Title:
プラズマチャンバ検証用のエッチング速度均一性を予測する方法、装置、及び、プログラム記憶媒体
Document Type and Number:
Japanese Patent JP5629770
Kind Code:
B2
Abstract:
A method for automatically identifying an optimal endpoint algorithm for qualifying a process endpoint during substrate processing within a plasma processing system is provided. The method includes receiving sensor data from a plurality of sensors during substrate processing of at least one substrate within the plasma processing system, wherein the sensor data includes a plurality of signal streams from a plurality of sensor channels. The method also includes identifying an endpoint domain, wherein the endpoint domain is an approximate period within which the process endpoint is expected to occur. The method further includes analyzing the sensor data to generate a set of potential endpoint signatures. The method yet also includes converting the set of potential endpoint signatures into a set of optimal endpoint algorithms. The method yet further includes importing one optimal endpoint algorithm of the set of optimal endpoint algorithms into production environment.
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Inventors:
チョイ・ブライアン・ディー．
ユン・グンス
ベヌゴパル・ビジャヤクマー・シー．
ユン・グンス
ベヌゴパル・ビジャヤクマー・シー．
Application Number:
JP2012518586A
Publication Date:
November 26, 2014
Filing Date:
June 29, 2010
Export Citation:
Assignee:
ラム リサーチ コーポレーションＬＡＭ ＲＥＳＥＡＲＣＨ ＣＯＲＰＯＲＡＴＩＯＮ
International Classes:
H01L21/3065
Attorney, Agent or Firm:
Patent business corporation Akinari international patent firm