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Patent Searching and Data


Title:
モジュール基板
Document Type and Number:
Japanese Patent JP5633582
Kind Code:
B2
Inventors:
片岡 祐治
鎌田 明彦
神凉 康一
北村 俊輔
Application Number:
JP2012554613A
Publication Date:
December 03, 2014
Filing Date:
August 30, 2011
Export Citation:
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Assignee:
株式会社村田製作所
International Classes:
H01L23/28; H01L23/00
Domestic Patent References:
JP2009016715A2009-01-22
JP2006294701A2006-10-26
JP2009016715A2009-01-22
Foreign References:
WO2010103756A12010-09-16
Attorney, Agent or Firm:
Masaya Fukunaga



 
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