Title:
プリント回路基板及びその製造方法
Document Type and Number:
Japanese Patent JP5635613
Kind Code:
B2
Abstract:
An embedded printed circuit board and a manufacturing method thereof are provided. The manufacturing method includes a first step of forming a first insulating layer having a seed layer formed on one side thereof and at least. one metal pattern embedded therein and a second step of laminating the first insulating layer and a base substrate with an inner circuit having a second insulating layer interposed between the first insulating layer and the base substrate. Accordingly, a printed circuit board with a circuit embedded in an insulating layer is provided, and thus a high-density and high-reliability printed circuit board can be achieved. Furthermore, since the printed circuit board is manufactured using a mold, a circuit manufacturing process for embedding, a process for forming a seed layer and a complicated process such as surface grinding are omitted so as to simplify the manufacturing process.
Inventors:
キム ジン ス
ナム ミョン ファ
ソ ヨン ウク
アン チ ヘ
ナム ミョン ファ
ソ ヨン ウク
アン チ ヘ
Application Number:
JP2012533067A
Publication Date:
December 03, 2014
Filing Date:
August 05, 2010
Export Citation:
Assignee:
エルジー イノテック カンパニー リミテッド
International Classes:
H05K3/20; H05K3/24
Attorney, Agent or Firm:
Aoki 篤
Tsuruta Junichi
Tomohiro Minamiyama
Ken-ichi Nakamura
Tsuruta Junichi
Tomohiro Minamiyama
Ken-ichi Nakamura