Title:
ウェハ供給装置およびチップボンディング装置
Document Type and Number:
Japanese Patent JP5635835
Kind Code:
B2
Inventors:
頼木 稔
Application Number:
JP2010183014A
Publication Date:
December 03, 2014
Filing Date:
August 18, 2010
Export Citation:
Assignee:
富士機械製造株式会社
International Classes:
H01L21/673; H01L21/52; H01L21/677
Attorney, Agent or Firm:
Michiaki Higashiguchi