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Patent Searching and Data


Title:
ウェハレベルレンズの製造方法
Document Type and Number:
Japanese Patent JP5637767
Kind Code:
B2
Abstract:

To provide a method of manufacturing a wafer level lens, the method manufacturing a wafer level lens having high light-shielding performance and preventing ghost and flare due to reflected light while restraining increase in manufacturing cost; and to provide a wafer level lens and an imaging unit.

This invention relates to a method of manufacturing the wafer level lens having at least one lens module including a substrate and a plurality of lenses formed on the substrate. The method includes steps of: forming a lens on the substrate; applying a black resist layer on the lens surface of the lens and the surface of the substrate; and forming the applied black resist layer in such a pattern that a portion intersecting the optical axis of the lens is open. Thus, the wafer level lens having high light-shielding performance and preventing ghost and flare due to reflected light can be manufactured while increase in manufacturing cost is restrained.

COPYRIGHT: (C)2011,JPO&INPIT


Inventors:
丸山 陽一
Application Number:
JP2010180627A
Publication Date:
December 10, 2014
Filing Date:
August 11, 2010
Export Citation:
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Assignee:
富士フイルム株式会社
International Classes:
G02B3/00; B29D11/00; G02B7/02; H04N5/225
Attorney, Agent or Firm:
Takamatsu 猛
Toshiyuki Ozawa
Hiromichi Hasegawa