Title:
ＣＭＰ用途における調節可能な選択性スラリー
Document Type and Number:
Japanese Patent JP5642962
Kind Code:
B2
Abstract:
The invention provides a method of preparing a chemical-mechanical polishing composition for polishing a substrate with at least a first layer and a second layer. The method comprises providing both a first chemical-mechanical polishing composition comprising an abrasive with a selectivity for a first layer as compared to a second layer and a second chemical-mechanical polishing composition comprising an abrasive with different selectivity for the first layer as compared to the second layer, wherein the second chemical-mechanical polishing composition is stable in the presence of the first chemical-mechanical polishing composition, and mixing the first and second chemical-mechanical polishing compositions in a ratio to achieve a final selectivity for the first layer as compared to the second layer. The invention further provides a method of chemically-mechanically polishing a substrate.
Inventors:
チェン，チャン
バカッシー，ロバート
バイエル，ベンジャミン
カンナ，ディネッシュ
バカッシー，ロバート
バイエル，ベンジャミン
カンナ，ディネッシュ
Application Number:
JP2009518144A
Publication Date:
December 17, 2014
Filing Date:
June 13, 2007
Export Citation:
Assignee:
キャボット マイクロエレクトロニクス コーポレイション
International Classes:
H01L21/304; B24B37/00; C09K3/14
Attorney, Agent or Firm:
Aoki 篤
Ishida 敬
Tetsuji Koga
Atsushi Ebiya
Ebita 尚則
Satoru Ideno
Ishida 敬
Tetsuji Koga
Atsushi Ebiya
Ebita 尚則
Satoru Ideno