Title:
大気接合用ろう材、接合体、および、集電材料
Document Type and Number:
Japanese Patent JP5645307
Kind Code:
B2
Abstract:
A brazing alloy for bonding in air can be melted at a temperature below the melting point ofAg and can improve the high-temperature durability of the bonded article. The brazing alloy for bonding in air contains Ag, B, and Si, as essential components, in which the total of constituent elements except for Ag is set to more than 50% by volume and not more than 90% by volume, Si content in the constituent elements except for Ag is set to more than 22% by volume, and B content in the constituent elements except for Ag is set to more than 14% by volume. For example, as shown in Fig. 4 , in a bonded layer 13 of a bonded specimen of the present invention, after holding at high temperature, no void 16 ( Fig. 6 ) as observed in a bonded specimen after holding at high temperature of a Comparative Sample was observed, the brazing alloy was sufficiently melted, and superior gas sealing characteristics were maintained even after holding at high temperature for a long time.
Inventors:
山内 雄一郎
斎藤 慎二
斎藤 慎二
Application Number:
JP2010274643A
Publication Date:
December 24, 2014
Filing Date:
December 09, 2010
Export Citation:
Assignee:
日本発條株式会社
International Classes:
B23K35/30; C22C5/06; H01M8/02; H01M8/12
Attorney, Agent or Firm:
End 成 Mikio