Title:
半導体装置
Document Type and Number:
Japanese Patent JP5645526
Kind Code:
B2
Inventors:
生松 均
Application Number:
JP2010167399A
Publication Date:
December 24, 2014
Filing Date:
July 26, 2010
Export Citation:
Assignee:
住友電工デバイス・イノベーション株式会社
International Classes:
H01L21/338; H01L29/06; H01L29/41; H01L29/778; H01L29/812
Attorney, Agent or Firm:
Shuhei Katayama