Title:
可搬式装置と共に使用するための超音波機械加工用組立体
Document Type and Number:
Japanese Patent JP5646734
Kind Code:
B2
Abstract:
A machining system that includes an ultrasonic machining assembly, wherein the ultrasonic machining assembly further includes a machining tool; a collet adapted to receive the machining tool; and an ultrasonic transducer, wherein the ultrasonic transducer is operative to transmit acoustical vibrations to the machining tool; and a machining apparatus, wherein the machining apparatus is adapted to receive and secure the ultrasonic machining assembly, and wherein the machining apparatus is operative to transmit torque to the machining tool by applying rotary motion to the ultrasonic machining assembly.
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Inventors:
ショート，マシュー・エイ
Application Number:
JP2013508213A
Publication Date:
December 24, 2014
Filing Date:
April 27, 2011
Export Citation:
Assignee:
エジソン・ウェルディング・インスティチュート，インコーポレーテッド
International Classes:
B23B37/00; B23B1/00
Attorney, Agent or Firm:
Ono Shinjiro
Kobayashi 泰
Hiroyuki Tomita
Hoshino 修
since north 亘
Kobayashi 泰
Hiroyuki Tomita
Hoshino 修
since north 亘