半導体レーザモジュールおよびその製造方法 - パナソニックＩＰマネジメント株式会社

Title:

半導体レーザモジュールおよびその製造方法

Document Type and Number:

Japanese Patent JP5649090

Kind Code:

B2

Abstract:

A semiconductor laser module includes a laser diode array, an optical fiber array, a fiber array fitting for fixing the optical fiber array, a casing, and a support fitting for fixing the fiber array fitting and casing. The fiber array fitting and support fitting have a first contact section that is in line-contact or surface-contact with the plane section parallel with the light emission surface of the laser diode array, and are laser-welded and fixed to each other at the first contact section. The support fitting and casing have a second contact section that is in line-contact or surface-contact with the plane section vertical to the light emission surface of the laser diode array, and are laser-welded and fixed to each other at the second contact section.

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Inventors:

龍堂誠
上田直人

Application Number:

JP2013514988A

Publication Date:

January 07, 2015

Filing Date:

May 14, 2012

Export Citation:

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