Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP5649547
Kind Code:
B2
Abstract:
According to one embodiment, a semiconductor device includes first, second, and third molded bodies. The first molded body covers a first light emitting element, a part of a lead electrically connected to the first light emitting element, a first light receiving element configured to detect a light emitted from the first light emitting element, and a part of a lead electrically connected to the first light receiving element with a first resin. The second molded body covers a second light emitting element, a part of a lead electrically connected to the second light emitting element, a second light receiving element configured to detect a light emitted from the second light emitting element, and a part of a lead electrically connected to the second light receiving element with the first resin. The third molded body molds the first and the second molded bodies as one body using a second resin.
Inventors:
竹下 篤史
田中 秀知
田中 秀知
Application Number:
JP2011224285A
Publication Date:
January 07, 2015
Filing Date:
October 11, 2011
Export Citation:
Assignee:
株式会社東芝
International Classes:
H01L31/12
Attorney, Agent or Firm:
Masahiko Hiugaji