Title:
モバイルコンピュータ装置表面の冷却を向上させる方法および装置
Document Type and Number:
Japanese Patent JP5655148
Kind Code:
B2
Abstract:
An apparatus with some embodiments is described having ducts positioned above and below a main device housing to provide cooling air flow to at least a portion of the top and bottom surfaces of the associated computing device. In some embodiments, the device is a mobile computing device. In some embodiments, air may be drawn through inlets located on at least one side of the device. The inlet air may be supplied via upper and lower air ducts to an air mover positioned on an opposite side of the device. In some embodiments, air discharged from the air mover may be supplied to a main housing of the device in which heat producing components may be located. Other embodiments are described.
Inventors:
マクダーナルド、マーク
Application Number:
JP2013528403A
Publication Date:
January 14, 2015
Filing Date:
September 26, 2011
Export Citation:
Assignee:
インテル・コーポレーション
International Classes:
G06F1/20; G06F1/16; H05K7/20
Attorney, Agent or Firm:
Ryuka international patent business corporation