Title:
接着剤組成物、フィルム状接着剤、接着剤シート及びそれを用いた半導体装置
Document Type and Number:
Japanese Patent JP5655885
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an adhesive composition formable of a film adhesive or the like, having both of process characteristics such as suitability to filling into an adherend and low-temperature laminating property, and characteristics which contribute toward improving reliability of semiconductor devices such as reflow resistance.SOLUTION: An adhesive composition contains a polyimide resin obtained by reacting tetracarboxylic acid dianhydride and a diamine, where the tetracarboxylic acid dianhydride expressed by formula (I) and the diamine expressed by formula (II) each is contained by 30% or more with respect of each component amount. The polyimide resin has a glass transition temperature of 10-100°C, melt viscosity at 100°C of 6,000 Pa s or lower, and when formed into a film, surface tack force of the film at 40°C is 200 gf or less.
Inventors:
川守 崇司
増子 崇
増子 崇
Application Number:
JP2013085026A
Publication Date:
January 21, 2015
Filing Date:
April 15, 2013
Export Citation:
Assignee:
日立化成株式会社
International Classes:
C09J179/08; C09J7/00; C09J7/02; H01L21/301; H01L21/52; H01L25/065; H01L25/07; H01L25/18
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Junichiro Sakamaki
Yoshinori Shimizu
Junichiro Sakamaki