Title:
はんだバンプ形成方法および装置
Document Type and Number:
Japanese Patent JP5656097
Kind Code:
B2
Abstract:
Provided is a solder bump forming method that enables micro-solder bumps to be formed without the possibility of occurrence of a bridge due to excess molten solder. An injection head 11 for supplying molten solder has a nozzle 16 brought into contact with a mask with openings that is disposed over a substrate 8. After completing a supply operation, the injection head 11 is forcedly cooled by heat transfer from a cooling unit 13 through a heater unit 12 whose operation has been stopped. Molten solder 15 in the cooled injection head 11 does not drool from the nozzle 16 when the injection head 11 moves up.
Inventors:
佐藤 一策
高口 彰
佐藤 勇
名内 孝
高口 彰
佐藤 勇
名内 孝
Application Number:
JP2013539676A
Publication Date:
January 21, 2015
Filing Date:
October 18, 2012
Export Citation:
Assignee:
千住金属工業株式会社
International Classes:
H01L21/60
Domestic Patent References:
| JPH1140937A | 1999-02-12 | |||
| JPH11345816A | 1999-12-14 | |||
| JP2003133359A | 2003-05-09 | |||
| JP2000294584A | 2000-10-20 | |||
| JP2002151534A | 2002-05-24 | |||
| JP2010010483A | 2010-01-14 | |||
| JPH1140937A | 1999-02-12 | |||
| JPH11345816A | 1999-12-14 | |||
| JP2003133359A | 2003-05-09 | |||
| JP2000294584A | 2000-10-20 | |||
| JP2002151534A | 2002-05-24 | |||
| JP2010010483A | 2010-01-14 |
Attorney, Agent or Firm:
Ono Shinjiro
Kobayashi 泰
Shigeo Takeuchi
Yamamoto 修
Ueda 充
Kobayashi 泰
Shigeo Takeuchi
Yamamoto 修
Ueda 充