Title:
電子部品とその製造方法
Document Type and Number:
Japanese Patent JP5658442
Kind Code:
B2
Abstract:
An electronic component in which an element is formed on a chip includes: a pad that is made of a conductive material and that is formed in a first bump formation region that is two-dimensionally arranged in center of one principle face and in a second bump formation region that is linearly arranged at peripheral border of the principle face; a passivation film that is formed on the principle face to cover portion except a formation position of the pad; a metal layer that is formed on the pad; and a bump that is made of a conductive material and that is formed on the metal layer by plating, wherein radius of the metal layer in the second bump formation region is smaller than radius of at least some of the metal layer in the first bump formation region.
Inventors:
右田 達夫
江澤 弘和
山下 創一
栂嵜 隆
江澤 弘和
山下 創一
栂嵜 隆
Application Number:
JP2009133400A
Publication Date:
January 28, 2015
Filing Date:
June 02, 2009
Export Citation:
Assignee:
株式会社東芝
International Classes:
H01L21/60; H01L25/065; H01L25/07; H01L25/18
Attorney, Agent or Firm:
Yasutaka Fujiwara