Title:
半導体ユニットおよびそれを用いた半導体装置
Document Type and Number:
Japanese Patent JP5659938
Kind Code:
B2
Abstract:
A semiconductor unit of certain aspects of the invention includes electrically conductive plates in the shape of the letter L, each consisting of a horizontally disposed leg portion and a vertically disposed flat body portion that is perpendicular to a cooling plate adhered to the bottom of the semiconductor unit. A pair of the vertically disposed flat body portions sandwiches a semiconductor chip. Owing to this construction, the heat generated in the semiconductor chip can be conducted away through the both surfaces of the chip, thus improving cooling performance. Since the heat is conducted away through the leg portions of the L-shaped electrically conductive plates a projected planar area occupied by the cooling plate required for cooling the semiconductor unit is reduced. Therefore, the size of the semiconductor unit can be reduced.
Inventors:
佐藤 憲一郎
Application Number:
JP2011097015A
Publication Date:
January 28, 2015
Filing Date:
April 25, 2011
Export Citation:
Assignee:
富士電機株式会社
International Classes:
H01L25/07; H01L25/18
Attorney, Agent or Firm:
Yoichi Matsumoto