Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
複数微細ひび割れ型繊維補強セメント複合材料を用いたライニング方法および構造体
Document Type and Number:
Japanese Patent JP5660524
Kind Code:
B2
Inventors:
國枝 稔
羽渕 貴士
網野 貴彦
Application Number:
JP2010048027A
Publication Date:
January 28, 2015
Filing Date:
March 04, 2010
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
國枝 稔
東亜建設工業株式会社
International Classes:
E04G23/02; E04B2/84
Attorney, Agent or Firm:
Daytime Takayoshi
Shin-ichi Ogawa
Masateru Noguchi
Kenji Sato
Isao Hirai
Masao Sakaizawa
斎下 Kazuhiko